Wedge bonding tools, capillaries, and bonding process accessories for advanced semiconductor packaging — from 10 µm ultra-fine pitch to heavy Cu/Al power applications. Factory-direct from our manufacturing base in Wuxi, China, with application support in Aachen, Germany.
Our Products
Gold Wire / Ribbon Wedge Tools
For advanced and THz packaging; supports gold wire down to 10 µm.
Aluminum Wire Wedge Tools
Optimized stress distribution reduces heel cracks and pad lifting.
Heavy Cu/Al Wire Bonding Tools
Ultra-long lifetime, no-clean design for power packaging.
Deep Access Fine-Pitch Wedge Tools
Near-wall geometry for reliable bonding in ultra-narrow spaces.
Ball Bonding Capillaries
For advanced packaging and CPO applications below 5 µm pitch.
Accessories & Die Bonding Tools
Cutters, wire guides, EFO wands, pick-up tools and more.
Why UPT
Manufacturer, Not a Middleman
You work directly with the factory: faster answers, better pricing, full traceability.
Consistency at Scale
Stable mass production ensures tool-to-tool repeatability your process can rely on.
Simulation-Driven Design
Every tool geometry validated by simulation before it reaches your bonder.
Fine-Pitch Capability
Stable bonding at 10 µm pitch, 20 µm feed holes, 5 µm CG grooves.
Applications
Advanced Packaging · SiP · Power Devices · RF & THz · Photonics / CPO · Heterogeneous Integration
About UPT
UPT (Wuxi Precision Creation Materials Technology Co., Ltd.) designs and manufactures precision bonding tools for the semiconductor packaging industry. With R&D and manufacturing in Wuxi and Chengdu, China, and our European subsidiary Rongtech GmbH operating an application center in Aachen, Germany, we support customers worldwide with factory-direct supply and local technical service.
Need help selecting the right bonding tool?
Send us your wire type, pitch, and bonder model — our engineers will recommend the right tool.