Verifying bond strength is a critical step in semiconductor package reliability evaluation. UPT supplies pull test hooks and shear test tools compatible with major bond testing platforms, used to confirm wire bond and die attach strength meet process quality standards.
DAGE · XYZ · ROYCE Compatible · Ball & Die Shear Testing · Custom Holders Available
Pull Test Hooks
Pull test hooks measure the force required to break a wire bond, confirming it meets strength requirements. UPT offers a range of pull test hooks sized to different wire diameters and bond testing requirements, compatible with DAGE, XYZ, ROYCE and other wire bond testing platforms used in semiconductor reliability evaluation.
Shear Test Tools
Ball shear tools (BST) and die shear tools (DST) test package reliability from two angles — ball bond shear strength and die adhesion strength. UPT offers multiple tip geometries, face widths and shear force ranges to match different package structures and testing standards. Custom shear tool holders are also available to match different machine interfaces and application requirements.
Full Pull Test Hook & Shear Test Tool Reference
UPT produces pull test hooks and shear test tools across a wide range of wire diameters, face widths and shear force ratings, and also accepts custom designs from your own drawings. Download the complete reference to see the full range of options.
How to Order
Not Sure Which Pull Test Hook or Shear Tool Fits Your Testing Setup?
Send us your bond testing platform, wire diameter, and required force or shear rating — our engineers will confirm the matching configuration and recommend the right part.