UPT ball bonding capillaries are engineered for advanced packaging and co-packaged optics (CPO) applications, delivering stable ball bonding at pad pitches below 5 µm-class geometries. Precision-machined ceramic tips with tightly controlled hole, chamfer and bottleneck dimensions ensure consistent ball formation, loop control and second-bond quality across high-volume production.
Series Selection Guide
S Series
Standard
General-purpose ball bondingB Series
Bottleneck
Improved tip compliance for fine pitchL Series
L-cut
Near-wall access in tight packagesBL Series
Bottleneck + L-cut
Deep-access fine-pitch combinedHow to Order
Order by Part Number
Every UPT capillary is specified by a structured part number covering tip style, hole diameter, finish, tool length, tip geometry (MTA, FA, T, CD), material, outer radius, inner chamfer angle, and bottleneck dimensions for B and BL types.
Capillary Guide →Not Sure Which Series Fits?
Send us your wire diameter, bond pad pitch, and bonder model — our engineers will recommend the right capillary configuration.
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Prefer the full specification tables?
Our Wire Bonding Tool Selection Catalog includes complete dimension tables, radius options and tool configurations for every series.