When package walls, tall components or dense wire loops crowd the bond site, standard tool geometry runs out of clearance. UPT deep-access and fine-pitch wedge tools are engineered for exactly these conditions — tapered profiles that reach into confined spaces, and tip geometries that hold bond quality at 10 µm-class pitch.
Stable bonding at 10 µm pitch · 20 µm feed holes · 5 µm CG grooves
Bonding in Confined, Fine-Pitch Packages
Cavity packages, RF modules and dense wire layouts often place bond pads within a few hundred microns of a package sidewall or die edge — conditions where standard tool geometry runs out of clearance before it reaches the pad. UPT deep-access and fine-pitch wedge tools are built for exactly this: tapered profiles that reach into confined spaces without contacting the sidewall, and tip geometries that hold bond quality even as pitch tightens.
The cross-section below is from an actual RF cavity package:
- Bond pad clearance to sidewall: 194.53 µm
- Bond pad clearance to die edge: 238.26 µm
- Cavity depth: ~282.45 µm
Reaching a pad at this depth and clearance without contacting the sidewall is exactly the condition UPT deep-access geometry is designed for.
Sample shown is a decommissioned die used for internal test purposes only and is not associated with any customer program.
How to Order
Tell Us Your Application
Not sure where to start? Describe your bonding application — package type, wire, pitch or clearance constraints — and our engineers will evaluate it and recommend the right tool geometry. If you’d rather browse first, the selection guide below covers every series by part number.
Not Sure Which Geometry Fits?
Send us your package cross-section or clearance drawing, wire type and pitch — our engineers will confirm tool reach and recommend the right configuration.
Request a Quote
Prefer the full specification tables?
Our Wire Bonding Tool Selection Catalog includes complete dimension tables, radius options and tool configurations for every series.