UPT gold wire and ribbon wedge bonding tools are designed for advanced and THz packaging applications, supporting gold wire down to 10 µm with stable bonding at 10 µm ultra-fine pitch. Compatible with both manual and automatic bonders and with 60 kHz–230 kHz ultrasonic systems, they deliver the feed-hole precision and groove geometry that demanding RF, photonics and fine-pitch applications require.
Minimum feed hole 20 µm · CG groove width 5 µm · Gold wire down to 10 µm
Series Selection Guide
Gold Wire Series
RA – CC · all Chapter 1 series
Every small-wire series is available configured for gold wireRibbon Series
JD · JDH
Dedicated ribbon wedges for 2–20 mil ribbon widthHow to Order
Order by Part Number
Every UPT wedge tool is specified by a structured part number covering material, series, wire feed, front/back radius, tool size, hole angle, foot type and length.
Part Number & Code Reference →Not Sure Which Series Fits?
Send us your wire type and diameter, bond pad pitch, and bonder model — our engineers will recommend the right tool configuration.
Ask Our Engineers →Request a Quote
Prefer the full specification tables?
Our Wire Bonding Tool Selection Catalog includes complete dimension tables, radius options and tool configurations for every series.