Suction Cup
Suction cups pick up lead frames, wafer frames, wafers and IC products using vacuum contact rather than a mechanical collet. UPT supplies suction cups in a range of sizes and materials, sized to the diameter and surface of the component being handled.
Multiple Series & Diameters · Custom Sizing on Request · For Frames, Wafers & IC Products
Suction Cup Series
UPT offers several suction cup series, differing in body profile and mounting style — each available across a range of diameters to match your component size.
- VP series (VP3.5H, VP4H, VP6H, VP7H, VP12H, VP13H) — standard vacuum cup profiles for general frame and wafer pickup
- ALP series (ALP5H, ALP6H, ALP8H) — alternative profile for specific mounting requirements
- ASM / SS7 / ICOS series — platform-specific and specialized profiles, including black-finish options
Series and diameter are selected together — the diameter (D) is sized to the component or the frame contact area, while the series determines the mounting profile.
Materials & Sizing
Suction cups can be produced in materials to match your process requirements, with diameters and mounting dimensions customized on request.
Full Suction Cup Series Reference
UPT produces suction cups across multiple series and diameters, and also accepts custom designs from your own drawings. Download the complete series reference to see the full range of profiles and sizing options.
How to Order
Not Sure Which Suction Cup Fits Your Component?
Send us the component type (lead frame, wafer frame, wafer or IC), its diameter, and your bonding equipment model — our engineers will confirm the series and recommend the right configuration.