Pick up tools are the first point of contact with the die — the
collet, tip or suction cup that lifts it from tape or wafer frame
before bonding. UPT supplies standard and fully customized pick up tools in plastic, metal, rubber and ceramic, plus the tip holders and suction cups used to mount and adapt them across different bonding platforms.
Plastic · Metal · Rubber · Ceramic · Hole sizes down to 0.08 mm
Tip Materials
UPT pick up tools are available in a range of materials to match your process requirements — from insulative plastics to conductive tungsten carbide, covering temperatures up to 1100°C.
- Ceramic — insulative, rated to 1100°C, for high-temperature bonding
- Tungsten Carbide — conductive, rated to 1000°C, for high-wear applications
- PEEK — insulative or dissipative, rated to 250°C, general-purpose plastic tip
16 materials are available in total, spanning plastic, metal, rubber and ceramic options with different hardness, temperature and resistivity ratings.
Standard & Customized Pick Up Tool
UPT supplies both off-the-shelf and fully customized pick up tools. Standard collets in plastic, metal and ceramic cover common die sizes and bonding platforms out of the box. For applications that need a specific interface, angle or porous structure, our engineers design and build customized plastic and metal tips to match your equipment and die geometry — including spring-loaded, angled and platform-specific configurations.
Send us your equipment model and die dimensions, and we’ll confirm whether a standard tool fits or recommend a customized design. Full body style references are available in the download below.
Choose a Pick Up Tool Type
Rubber Tip
Rubber tips for gentle die pickup at normal or high temperature, with hole diameters as small as 0.08 mm, paired with stainless steel tip holders.
Tungsten Carbide Tip
Engineered tungsten carbide tips for inverted-pyramid and inverted-channel die profiles, built on UPT’s own part numbering system across four shank structures.
Tip Holder
Stainless steel shanks that mount rubber tips to a wide range of die bonding equipment — sized to match your machine interface.
Suction Cup
Suction cups for picking up lead frames, wafer frames, wafers and IC products, available in a range of sizes and materials.
How to Order
Not Sure Which Pick Up Tool Fits Your Process?
Send us your die size, bonding equipment model, and material preference — our engineers will confirm the tool style and recommend the right configuration. Full dimensional tables for every series are available on request.